B.R. Peterson Associates - Manufacturing Equipment, Supplies and Services

Manufacturers' Representatives

Manufacturing Equipment, Supplies and Services

Illinois - Wisconsin

Since 1991, B.R. Peterson has covered the upper Midwest, providing manufacturers' representative services to many of the top suppliers of electronics manufacturing equipment, supplies and services. B.R. Peterson Associates bridges the gap between customer requirements and supplier's expertise.

Markets Served

l 40% Contract Manufacturing l 30% Industrial Control l 9% Automotive l 6% Communications l 15% Def/Med/Other

Manufacturing Equipment

Inspection & Test Equipment

Materials & Supplies

Manufacturing Services

Electronic Assembly Equipment

Screen Printers
Adhesive Dispensers
Pick and Place
Reflow Ovens
Wave Solder
Selective Solder
Materials Handling
Laser marking
Depaneling
Axial Insertion
Radial Insertion
Semi-Auto Through Hole
Conformal coating
ISP Part Programming

Microelectronic Equipment

Die Bonders
Flip Chip Bonders
GGI Bonders
Plasma Cleanin

Inspection Equipment

AOI/Optical Inspection

Solder Paste
Pre-reflow
Post-reflow
Conformal coat

X-Ray Inspection

Semi-auto
In-line 2D
In-line 3D

Test Equipment

ICT/In-Circuit Test
Boundary-Scan
Functional Test
Test jet Technology

PCB/Printed Circuit Boards

Single sided to 44 layers
Rigid, Flex, and Rigid/Flex
Prototype through domestic and off shore production

Solder Materials

Solder Paste
Bar Solder
Fluxes

Engineering Consulting Services

Panasonic engineering solutions and enterprise consulting offerings can transform your facility to a best-in-class level of manufacturing. These services and training classes are designed to help you to get maximum return from your capital equipment investment.

Whether it's reducing scrap and rework costs or automating a previously manual job, these services will help you reduce costs.

Advanced Packaging Lab

To better serve the advanced packaging needs for equipment and process solutions, Panasonic offers a unique lab facility in the Chicago area that includes the latest in microelectronics assembly machines and failure analysis metrology for post-assembly analysis. The Advanced Packaging Lab is dedicated to working with the industry in developing and implementing new technologies for the packaging and manufacturing of microelectronics.